Research Facilities
Cascade Microtech S300 12" Semiconductor
Probestation
This probe station is one of two of its kind in the
Hesse and Knipps Bondjet 710 wire
bonder
Our wire bonder is a fully automatic wedge to wedge wire bonder. It has a
comprehensive suite of parameter measurement and analysis tools that records
the strength and bondquality for each bond as it is laid down by the machine.
This machine was used to bond three hundred modules during the ATLAS SCT
production in
Disco DAD 321 Automatic Dicing Saw
This is a fully programmable dicing saw for the precision dicing of wafers
up to 100 mm in diameter. It is used to
dice objects from silicon, GaAs and glass for different research projects that
the group is involved in.
Fabrication Facilities
The Experimental Particle Physics group utilise micro and nano-fabrication
technology to make many of their devices. Some of the fabrication work is
carried out using the equipment located in the James Watt Nano-Fabrication Centre.
Devices are patterned using either a Karl Suss MA6 mask aligner, an EBPG 5HR
100, or a VB6 UHR EWF electron beam lithography tool. Some of the other pieces
of equipment used include Dry Etch machines, Plassys metallisation equipment,
Optical surface
profiler
The Wyko NT1100
Optical surface profiler from Veeco is a
metrology system using non-contact interferometry to measure surface features.
The system has two measurement modes:
Vertical shift interferometry (VSI): this uses white light and is used for
measuring features in the range 140 nm to several mm
Phase shift interferometry (PSI): utilising a filtered light source and a piezo
electric phase shift - small features can be measured, from ~1 to 140 nm.
The
system has an automated stitching stage for large area coverage. Measurements
can be made on any reflective surface.
TM1000 SEM
The Hitachi
TM1000 table top SEM is a self contained SEM. Able to take samples sizes 50
mm in diameter and up to a max of 20 mm height. The system has a pump down time
of less than 5 minutes with a maximum magnification of x10k giving a resolution
of ~30 nm. It also features a facility to image insulating surfaces using an
air micro-bleed to prevent charge
buildup.
Olympus Nomarski DIC microscope
This microscope
has the choice of reflected or transmitted light observation with a maximum
magnification of 100x. The microscope has a range of features including
●
Darkfield observation
●
Polariser and analyser for stress observation
●
Differential image contrast (DIC) measurement
●
UV source for fluorescence of biological samples
● Olympus CELL DAQ software running off of a DP-70 12.5 Mpix
digital camera
HAAS VM-2SE milling centre
HAAS VM-2SE
fully automated 5-axis vertical milling centre for manufacturing large
mechanical structures and small complex parts. Maximum table size 760x 610x 610
mm. The mill has high speed machining capabilities with the 4th and 5th axis
fully integrated and controlled through dedicated post processor sofware. The
tool is capable of milling to better than 10 micron precision over the entire
machining volume.
For further information on any of the equipment here contact Val O’Shea /Liam Cunningham